Electronic epoxy potting adhesive
Description
It is a two-component protect the electronic devices, conductivity silicone potting
material, flexible, flowable, industrial grade epoxy potting compound with extended work life.
Once mixed, the two-part epoxy cures at room temperature to form a rigid encapsulant that is non-corrosive to metallic components on electrical appliances fully cured epoxy provides excellent environmental and chemical resistance, and acts as an electrical insulator.
Usage
Designed for bonding, potting and encapsulating electrical components which are sensitive to corrosion and endure harsh operating conditions of electrical uses.
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Electronic applications.
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Component attachment to boards.
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Housing assembly and potting.
Where to Use
Features:
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Flexible.
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Low viscosity.
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Temperature Resistance.
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Lower labor cost.
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Protect electronic devices and electrical industries operation.
How to Use
1. These products may be applied using a spatula, trowel, or suitable flow equipment.
2. Wipe surfaces clean of dust using an oil-free solvent such as acetone or isopropyl alcohol.
3. Wear gloves during application and avoid direct contact with skin. Do not use solvents to clean adhesive from skin or hands.
4. Remove the cap, attach the mixing nozzle, and install the cartridge into the dispenser. Dispense a small amount first to ensure both sides are flowing freely. For hand mixing, dispense the required amount of material and mix thoroughly until a uniform color is achieved.
5. Pour as needed into forms, molds, or encapsulation shells.
6. For maximum bond strength, apply the adhesive evenly to both surfaces to be joined.
7. Apply the adhesive to the substrates within 10 minutes. Larger quantities and/or higher temperatures will reduce this working time.
8. Keep parts from moving during curing. Contact pressure is necessary. Maximum shear strength is obtained with a 3–9 mil bond line.
9. Excess uncured adhesive can be cleaned up using ketone-type solvents.
Technical Data
